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ABOUT US
Shanghai PANCHIP Microelectronics Co., Ltd. is one of the leading wireless communication and IoT chip design companies in China, which was founded by an experienced doctor from America in 2010. The headquarter locates in Shanghai, with R&D center in Suzhou and a branch in Shenzhen.PANCHIP has developed Chirp-IOT, a wireless spread spectrum communication platform based on the Internet of Things, and original phase modulation technology. Our low-power WAN physical layer chip compatible with the mainstream LPWAN protocol breaks the monopoly of foreign companies in this field. Moreover, it is a completely domestic chip with independent intellectual property rights, with industry-leading performance, cost and reliability.With our new developed retail shelf labeling system based on ultra-low power 2.4GHz technology, we cooperated with Alibaba IOT Division and firstly started the whole business process, including label, communication card, gateway and cloud on the Alibaba Feiyan Platform. This shelf label products have been produced and shipped massively. In the field of indoor positioning, the company takes the lead in the research of the Bluetooth AOA technology in China, and will soon launch the first indoor positioning system xLOCATE 1.0 based on Bluetooth AOA technology, with advantages of high positioning accuracy 0.5~1.0m and extremely low cost. It is certain to create a precedent for high-precision positioning technology in industrial environments.
HISTORY
2019-09

Bluetooth BLE 5.1 SoC MPW(with AOA positioning system) tape-out

2019-09

Chirp-IOT Chip begins to be used in Mobile Demo Testing

2019-09

The first generation of new retail chips (shelf labels) based on 2.4 GHz

2019
2018-09

Series A+ round investment entries

2018-09

Iconic key accounts design-in

2018-09

The first generation of image processing chip Mass production

2018
2017-09

Series A round investment entries

2017-09

Significant progress in Chirp-IOT chip research and development

2017-09

Bluetooth BLE 4.2 SoC Mass production

2017-09

The first generation of 2.4G SoC Mass production

2017
2016-09

Angel Investment

2016-09

Shenzhen Office Launched

2016
2015-09

The second generation of 2.4G wireless communication chip mass sales

2015-09

The first generation of single-touch chip mass sales

2015
2014-09

The first generation of 2.4G wireless communication chip mass sales

2014
2013
2010-09

R&D Center Launched in Suzhou

2010-09

Company Founded in Shanghai

2010
CULTURE
Leadership and Excellence
Innovation
Open and Respect
Sincerity and Mutual Trust
Sincerity and mutual trustSincerity and mutual trustSincerity and mutual trust
PARTNER
HONOR
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Honor
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RECRUIT
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  • Digital communication engineer(Shanghai or Suzhou)
    上海(ShangHai)
    3
    数字部门(Digital department)
    2019.09.23
    Info
    Duty:

    1、 Design communication modulation and demodulation system and simulate with Matlab or C with algorithm engineers.

    2、 Write RTL to design and implement communication system.

    3、 EDA simulation and FPGA verification and testing

    4、 Participate in system integration (including RF, ADC/DAC, modem/demodulator, protocol stack, MCU, etc.)

    5、 Lead or participate in chip test 


    Requirement:

    1、 Communication engineering, electrical engineering and other related majors

    2、 In-depth understanding of communication theory and digital signal processing, strong ability of learning and analyzing problems.

    3、 Proficient in verilog/VHDL, Matlab, Simulink and C language

    4、 Experience with BLE, WIFI, GPS/BDS, or other communication chip design is preferred

    5Experience with tape-out , FPGA design experience or hardware design is preferred 


    To ensure that we can see your work smoothly, your resume and portfolio should be in PDF or PPT format, and the total size is less than 10M.
    Delivery
  • Layout design engineer
    上海/苏州(Shanghai/Suzhou)
    模拟部门(Analog department)
    2019.09.23
    Info
    Duty:

    1、Deep knowledge of RF, mixed-signal chip layout design process and LVS/DRC
    2、Familiar with CMOS technology fabrication process, experienced in Floorplanning

    3、High proficiency in Cadence layout tools, understand the layout design under high frequency, low noise and other conditions
    4、Experience with IO layout design, Latch-up, ESD, and antenna effects in layout design
    5、Strong experience with full-custom IC product tape-out
    6、Knowledge of PR is preferred 


    Requirement:

    1、Experience on IC Layout
    2、Proficiency in English
    3、Team spirit and good communication with design engineers 

    To ensure that we can see your work smoothly, your resume and portfolio should be in PDF or PPT format, and the total size is less than 10M.
    Delivery
  • Analog circuit engineer
    上海/苏州(Shanghai/Suzhou)
    模拟部门(Analog department)
    2019.09.12
    Info
    Duty:

    1、Independently design the system architecture, prepare design specifications of circuit blocks and finish digital-analog mixed simulation

    2、Design and validate circuit according to product specifications; complete design and test document.

    3、Guide layout engineers to complete layout design that meets circuit design requirements

    4、Complete the application scheme of the product.


    Requirement:

    1、Master degree or above in related fields such as electronic information

    2、Comprehensive simulation skills in EDA tools.

    3、The following relevant experience is preferred: circuit design for low voltage, low power products, RF circuit design, RF transceiver development, high precision Sigma-Delta ADC/DAC IP design, LDO/Charge Pump design, etc.

    4、Fluent in English reading and writing, good R&D documentation, and learning ability


    To ensure that we can see your work smoothly, your resume and portfolio should be in PDF or PPT format, and the total size is less than 10M.
    Delivery
  • RFIC Designer
    上海(ShangHai)
    模拟部门(Analog department)
    2019.09.12
    Info
    Duty:

    1Design CMOS RF transceiver circuit and system, prepare design specifications and realize schemes.
    2Independently design or lead the team to design RF circuit modules, including system architecture, behavioral and circuit level simulation, circuit implementation and chip testing, and system level RF applications.



    Requirement:

    1、Master's degree or above in analog and RF IC design

    2、Experience in RF IC design, successful tape-out and mass production experience;
    3Deep knowledge of wireless communication, RF circuit design process, RF circuit theory, electromagnetic field and microwaves.

    3、Deep knowledge of basic RF transceiver structure, basic RF circuit including VCO, PLL, PA, MIXER, VGA, etc. and RF circuit layout.

    Ability to complete circuit design, modeling, simulation and debug.

    5Significant knowledge of RF test instruments, such as network analyzers, spectrum analyzers, signal generators, etc.;

    Master test methods for RF circuits

    6、Familiar with EDA software, including Cadence Spectre, ADS, HFSS, etc.

    7、Familiar with the 55nm, 110nm, 180nm Mixed-Signal process of TSMC, SMIC, HHGrace, etc.
    8Innovative, good communication skills and team spirit, relevant project management experience


    To ensure that we can see your work smoothly, your resume and portfolio should be in PDF or PPT format, and the total size is less than 10M.
    Delivery
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